Semiconductor device, semiconductor package, and method for testing semiconductor device

ABSTRACT

A semiconductor device designed to facilitate testing. Superimposed first and second semiconductor chips each include a plurality of internal terminals, an external terminal, and a plurality of transistors. A plurality of wires connect the internal terminals, the transistors, and the external terminals of the first and second semiconductor chips in series.

This is a Divisional of U.S. patent application Ser. No. 10/347,868,which was filed on Jan. 22, 2003 now U.S. Pat. No. 6,909,172, and isentitled “SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FORTESTING SEMICONDUCTOR DEVICE”, the disclosure of which is herebyincorporated by reference herein in its entirety.

CROSS-REFERENCED TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2002-187994, filed on Jun. 27,2002, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device, a semiconductorpackage, and a method for testing a semiconductor device.

A multi-chip package (MCP) includes multiple chips having variousfunctions. Such a multi-chip package is becoming popular sincesemiconductor chips are becoming more compact. An MCP that includeschips provided with the functions of a memory or a logic circuit, whichare connected to each other by a wiring, is referred to as asystem-in-package (SIP).

In an MCP, the number of terminals connecting chips (i.e., the number ofterminals per chip) is increased to widen the bus and improve datatransfer efficiency. The increase in the number of terminals causes thetesting of the MCP that is conducted subsequent to the assembly of thepackage to become complicated. Accordingly, the testing of the MCP mustbe conducted with higher efficiency and accuracy.

An external terminal of a chip, which is installed on the MCP, is usedto conduct the MCP testing. Deficient MCPs are located through the MCPtesting. Only MCPs functioning normally pass the test and become finalproducts.

In the conventional MCP testing, the location of deficient MCPs isperformed in package units. Thus, there is no way to tell whether thedeficiency is due to a chip of the MCP or due to the connection of thechips. As a result, when there is a flaw in the connection betweenchips, an MCP is determined as being deficient even though the chips arefunctioning normally. In this manner, in the conventional MCP testing,the cause of the MCP deficiency cannot be located. Thus, such an MCP isdestroyed without remediating the deficient location. This is anobstacle for increasing the yield of the MCPs.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice and semiconductor package designed to facilitate testing and atesting method that improves the accuracy for testing a semiconductordevice.

To achieve the above object, the present invention provides asemiconductor device including a plurality of semiconductor chipsconnected to each other by a plurality of wires. Each of thesemiconductor chips includes a plurality of internal terminals connectedto the plurality of wires, a first external terminal, and a secondexternal terminal. The plurality of internal terminals including a firstinternal terminal adjacent to the first external terminal, and a secondinternal terminal adjacent to the second external terminal. Anintermediate switch device is connected between the plurality ofinternal terminals so that the plurality of wires and the internalterminals are connected in series. A first end switch device isconnected between the first internal terminal and the first externalterminal. A second end switch device is connected between the secondinternal terminal and the second external terminal.

A further aspect of the present invention is a semiconductor devicecomprising at least two semiconductor chips, each having a plurality ofinternal terminals with the internal terminals of the two semiconductorchips connected to one another by a plurality of wires. Each of thesemiconductor chips includes at least one redundant terminal. A testcircuit detects whether there is an internal terminal causing aconnection flaw and for generating a plurality of test signals, eachcorresponding to one of the plurality of internal terminals. A switchingcircuit unit for switching a first set of the plurality of internalterminals including the internal terminal causing a connection flaw to asecond set of the plurality of internal terminals excluding the internalterminal causing a connection flaw and the at least one redundantterminal.

A further aspect of the present invention is a semiconductor deviceincluding at least two semiconductor chips, each having a plurality ofinternal terminals. Each of the semiconductor chips includes at leastone redundant terminal. A test circuit detects whether there is aninternal terminal causing a connection flaw and for generating aplurality of test signals, each corresponding to one of the plurality ofinternal terminals. A switching circuit unit switches the internalterminal causing a connection flaw to the at least one redundantterminal.

A further aspect of the present invention is a semiconductor deviceincluding two semiconductor chips, each having a plurality of internalterminals, a first external terminal, and a second external terminal.The plurality of internal terminals include a first internal terminaladjacent to the first external terminal, and a second internal terminaladjacent to the second external terminal with the internal terminals ofthe two semiconductor chips connected to one another by a plurality ofwires. Each of the semiconductor chips including at least one redundantterminal. A test circuit detects whether there is an internal terminalcausing a connection flaw and for generating a plurality of testsignals, each corresponding to one of the plurality of internalterminals. A switching circuit unit switches a first set of theplurality of internal terminals including the internal terminal causinga connection flaw to a second set of the plurality of internal terminalsexcluding the internal terminal causing a connection flaw and the atleast one redundant. An intermediate switch device connected between theplurality of internal terminals so that the plurality of wires and theinternal terminals are connected in series. A first end switch device isconnected between the first internal terminal and the first externalterminal. A second end switch device connected between the secondinternal terminal and the second external terminal.

A further aspect of the present invention is a semiconductor deviceincluding at least two semiconductor chips, each having a plurality ofinternal terminals, a first external terminal, and a second externalterminal. The plurality of internal terminals include a first internalterminal adjacent to the first external terminal and a second internalterminal adjacent to the second external terminal. Each of thesemiconductor chips includes at least one redundant terminal, a testcircuit for detecting whether there is an internal terminal causing aconnection flaw and for generating a plurality of test signals, eachcorresponding to one of the plurality of internal terminals. A switchingcircuit unit switches the internal terminal causing a connection flaw tothe at least one redundant terminal. An intermediate switch device isconnected between the plurality of internal terminals so that theplurality of wires and the internal terminals are connected in series. Afirst end switch device is connected between the first internal terminaland the first external terminal. A second end switch device is connectedbetween the second internal terminal and the second external terminal.

A further aspect of the present invention is a semiconductor packageincluding a semiconductor device. The semiconductor device includes aplurality of semiconductor chips connected to each other by a pluralityof wires with each of the semiconductor chips including a plurality ofinternal terminals connected to the plurality of wires. An intermediateswitch device is connected between the plurality of internal terminalsso that the plurality of wires and the internal terminals are connectedin series. A first end switch device is connected between the firstinternal terminal and the first external terminal. A second end switchdevice is connected between the second internal terminal and the secondexternal terminal.

A further aspect of the present invention is a semiconductor packageincluding a semiconductor device including at least two semiconductorchips. Each semiconductor chip includes a plurality of internalterminals with the internal terminals of the two semiconductor chipsconnected to one another by a plurality of wires, at least one redundantterminal, and a test circuit for detecting whether there is an internalterminal causing a connection flaw and for generating a plurality oftest signals, each corresponding to one of the plurality of internalterminals. A switching circuit unit switches a first set of theplurality of internal terminals including the internal terminal causinga connection flaw to a second set of the plurality of internal terminalsexcluding the internal terminal causing a connection flaw and the atleast one redundant terminal.

A further aspect of the present invention is a method for testing asemiconductor device. The semiconductor device includes a plurality ofsemiconductor chips connected to each other by a plurality of wires,each of the semiconductor chips including an external terminal and aplurality of internal terminals connected to the plurality of wires. Themethod includes connecting the wires and the internal terminals inseries, connecting a first end switch device between the first internalterminal and the first external terminal, connecting a second end switchdevice between the second internal terminal and the second externalterminal, testing conduction between the first external terminal and thesecond external terminal.

Other aspects and advantages of the present invention will becomeapparent from the following description, taken in conjunction with theaccompanying drawings, illustrating by way of example the principles ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention, together with objects and advantages thereof, may best beunderstood by reference to the following description of the presentlypreferred embodiments together with the accompanying drawings in which:

FIG. 1 is a schematic diagram of an MCP according to a first embodimentof the present invention;

FIG. 2 is a schematic diagram of a circuit for detecting a connectionflaw;

FIG. 3 is a schematic diagram of a circuit for remediating a connectionflaw;

FIG. 4 is a circuit diagram of a determination result holding circuit;

FIG. 5 is a circuit diagram of a determination result holding circuit ina further embodiment of the present invention; and

FIG. 6 is a schematic diagram of a circuit for remediating a flaw in asecond embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A multi-chip package (MCP) according to a first embodiment of thepresent invention will now be discussed.

Referring to FIG. 1, the MCP 11 is a stack type MCP, in which asemiconductor device including a plurality of semiconductor chips 13, 14is arranged on a substrate 12. The chips 13, 14 have a plurality ofinternal terminals 13 a, 14 a, respectively. The internal terminals 13a, 14 a are connected to one another by wires 15. Further, the chips 13,14 have a plurality of external terminals 13 b, 14 b, respectively. Theexternal terminals 13 b, 14 b are connected to a plurality of substrateterminals 12 a, which are arranged on the substrate 12, by wires 15. Aplurality of electrodes (solder balls) 16 are arranged on the bottomportion of the substrate 12. The MCP 11 is connected to a furthersubstrate (not shown) by means of the electrodes 16.

Referring to FIG. 2, the detection of a flaw in the connection betweenthe first chip 13 and the second chip 14 of the MCP 11 will now bediscussed.

The first chip 13 includes two external terminals 21, 22, whichcorrespond to the external terminals 13 b of FIG. 1, and three internalterminals 23 to 25, which correspond to the internal terminals 13 a ofFIG. 1. The second chip 14 includes external terminals 26, 27, whichcorrespond to the external terminals 14 b of FIG. 1, and internalterminals 28 to 30, which correspond to the internal terminals 14 a ofFIG. 1. The internal terminals 23, 24, 25 of the first chip 13 arerespectively connected to the internal terminals 30, 29, 28 of thesecond chip 14 by means of the wires 15 (three shown in FIG. 2). Theexternal terminal 21 of the first chip 13 and the external terminal 26of the second chip 14 are control external terminals. The externalterminal 22 of the first chip 13 and the external terminal 27 of thesecond chip 14 are conductive external terminals.

The first chip 13 includes switch devices, or n-channel MOS transistors31, 32. The end transistor 31 connects the external terminal 22 and theinternal terminal 23, and the intermediate transistor 32 connects thetwo internal terminals 24, 25. The gates of the transistors 31, 32 areconnected to the external terminal 21.

The second chip 14 includes switch devices, or n-channel MOS transistors33, 34. The end transistor 33 connects the external terminal 27 and theinternal terminal 28, and the intermediate transistor 34 connects thetwo internal terminals 29, 30. The gates of the transistors 33, 34 areconnected to the external terminal 26.

The internal terminals 23-25 and 28-30, the transistors 31-34, and thewires 15 are connected in series between the external terminal 22 of thefirst chip 13 and the external terminal 27 of the second chip 14.

The transistors 31-34 are activated when the external terminals 21, 26are provided with a signal having a high level. This causes the twoexternal terminals 22, 27 to become conductive by means of thetransistors 31-34, the internal terminals 23-25, 28-30, and the wires15. Accordingly, a flaw in the connection between the first chip 13 andthe second chip 14, or a connection flaw of the wires 15, may bedetected by performing a conduction test on the MCP 11.

The remediation of a connection flaw using a redundancy function willnow be discussed with reference to FIG. 3.

The first chip 13 includes terminals 41 to 44, which correspond to theinternal terminals 13 a of FIG. 1, and at least one redundant terminal45, which is used to remediate a connection flaw. The second chip 14includes terminals 46 to 49, which correspond to the internal terminals14 a of FIG. 1, and at least one redundant terminal 50, which is used toremediate a connection flaw. The number of the redundant terminals 45 ofthe first chip 13 is the same as the number of the redundant terminals50 of the second chip 14. FIG. 3 does not show a configuration fordetecting the connection flaw of FIG. 2.

The internal terminals 41-44 and the redundant terminal 45 of the firstchip 13 are respectively connected to the internal terminals 46-49 andthe redundant terminal 50 of the second chip 14 by wires 15.

The internal terminals 41-44 and the redundant terminal 45 of the firstchip 13 are connected to a first switching circuit unit 51. The firstswitching circuit unit 51 is connected to input/output terminals I1 toI4 of an internal circuit (not shown). The internal terminals 46-49 andthe redundant terminal 50 of the second chip 14 are connected to asecond switching circuit unit 52. The second switching circuit unit 52is connected to input/output terminals I5 to I8 of an internal circuit(not shown).

The first switching circuit unit 51 will now be discussed. Theconfigurations of the first and second switching circuit units 51, 52are the same. Thus, the second switching circuit unit 52 will not bediscussed in detail.

The first switching circuit unit 51 includes first to fourthdetermination result holding circuits 53 a, 53 b, 53 c, 53 d and firstto fourth switch circuits 54 a, 54 b, 54 c, 54 d, which are respectivelyconnected to the determination result holding circuits 53 a-53 d. Thedetermination result holding circuits 53 a-53 d are respectivelyarranged in correspondence with the internal terminals 41-44 of thefirst chip 13. FIG. 3 illustrates the four determination result holdingcircuits 53 a-53 d and the four internal terminals 41-44.

Each of the first to fourth switch circuits 54 a-54 d includes aninverter circuit 61, a first transistor 62, and a second transistor 63.The first and second transistors 62, 63 are n-channel MOS transistors.

The first transistor 62 is connected to the input/output terminal I1 andthe internal terminal 41. The output signal of the first determinationresult holding circuit 53 a is input to the gate of the first transistor62. The second transistor 63 is connected to the input/output terminalI1 and the internal terminal 42. The output signal of the firstdetermination result holding circuit 53 a is input to the gate of thesecond transistor 63 via the inverter circuit 61. The first switchcircuit 54 a switches the terminal to which the input/output terminal I1is connected to either one of the input terminals 41, 42 in accordancewith the output signal of the first determination result holding circuit53 a.

The second switch circuit 54 b switches the terminal to which theinput/output terminal I2 is connected to either one of the inputterminals 42, 43 in accordance with the output signal of the seconddetermination result holding circuit 53 b. The third switch circuit 54 cswitches the terminal to which the input/output terminal I3 is connectedto either one of the input terminals 43, 44 in accordance with theoutput signal of the third determination result holding circuit 53 c.

In the fourth circuit 54 d, the first transistor 62′ is connected to theinput/output terminal I4 and the internal terminal 44. The output signalof the fourth determination result holding circuit 53 d is input to thegate of the first transistor 62. The second transistor 63 is connectedto the input/output terminal I4 and the redundant terminal 45. Theoutput signal of the fourth determination result holding circuit 53 d isinput to the gate of the second transistor 63 via the inverter circuit61. Therefore, the fourth switch circuit 54 d switches the terminal towhich the input/output terminal I4 is connected to either one of theinput terminal 44 and the redundant terminal 45 in accordance with theoutput signal of the fourth determination result holding circuit 53 d.

A built-in self test (BIST) circuit 64, which is incorporated in thefirst chip 13, detects a flaw in the connection between the first chip13 and the second chip 14 (i.e., detects deficient terminals in thefirst chip 13 and the second chip 14) and generates test signals TB1 toTB4 in accordance with the detection result. The first to fourthdetermination result holding circuits 53 a-53 d respectively receive thetest signals TB1-TB4 from the BIST circuit 64.

Referring to FIG. 4, the first determination result holding circuit 53 aincludes p-channel MOS transistors 71, 72, n-channel MOS transistors 73,74, a flip-flop circuit 75, a resistor 76, and a NOR circuit 77. Thesecond to fourth determination result holding circuits 53 b-53 d areconfigured in the same manner as the first determination result holdingcircuit 53 a and thus will not be described.

The source of the transistor 71 is connected to a power supply VCC, andthe drain of the transistor 71 is connected to the ground GND via theresistor 76. The gate of the transistor 71 is connected to an inputterminal TE1 of the first determination result holding circuit 53 a. Thegate of the transistor 73 is connected to a node between the transistor71 and the resistor 76 via the flip-flop circuit 75 and to the gates ofthe transistors 72, 74. The source of the transistor 72 is connected tothe power supply VCC, and the drain of the transistor 74 is connected tothe drain of the transistor 74. The source of the transistor 74 isconnected to the ground GND. The NOR circuit 77 has two input terminals,one of which is connected to a node between the transistors 72, 74 andthe other one of which is connected to the ground GND. The output signalof the NOR circuit 77 is the output signal of the first determinationresult holding circuit 53 a and is output from the output terminal TE2.

Normally, the BIST circuit 64 provides the input terminal TE1 of thefirst determination result holding circuit 53 a with a signal having ahigh level. Further, the transistor 71 is inactivated, the flip-flopcircuit 75 outputs a signal having a high level, and the transistor 74is activated. Accordingly, the NOR circuit 77 outputs a signal having ahigh level to the output terminal TE2.

From this state, when the BIST circuit 64 provides the input terminalTE1 with a signal having a low level, the low signal is input to thegate of the transistor 71 via the transistor 73 and activates thetransistor 71. As a result, the flip-flop circuit 75 outputs a signalhaving a low level and activates the transistor 72. Accordingly, the NORcircuit 77 outputs a signal having a low level from the output terminalTE2.

In this state, the transistor 73 is inactivated even if the inputterminal TE1 receives a high level signal. Thus, the flip-flop circuit75 outputs the low signal. Accordingly, the NOR circuit 77 outputs asignal that is held at a low level from the output terminal TE2.

Each of the first to fourth determination result holding circuits 53a-53 d may be replaced by a determination result holding circuit 80illustrated in FIG. 5. The determination result holding circuit 80includes p-channel MOS transistors 81, 82, an n-channel MOS transistor83, a resistor 84, a fuse 85, and a NOR circuit 86.

The source of the transistor 81 is connected to a power source VCCH, andthe drain of the transistor 81 is connected to the ground GND via thesource of the transistor 83 and the fuse 85. The gate of the transistor81 is connected to the gates of the transistors 82, 83. The gates of thetransistor 81 are connected to the gates of the transistors 82, 83.Further, the gates of the transistors 81, 82, 83 are connected to theinput terminal TE1. The source of the transistor 82 is connected to thepower source VCC, and the drain of the transistor 82 is connected to thedrain of the transistor 83. The drain of the transistor 83 is connectedto the power supply VCC via the resistor 84. The NOR circuit 86 has twoinput terminals, one of which is connected to a node between thetransistors 82, 83 and the other of which is connected to the groundGND. The output signal of the NOR circuit 86 is the output signal of thedetermination result holding circuit 80 and is output from the outputterminal TE2.

When the input terminal TE1 of the determination result holding circuit80 receives a signal having a high level, the transistor 83 isactivated. As a result, the NOR circuit 86 outputs a signal having ahigh level. When a signal having a low level is input to the inputterminal TE1, the transistors 81, 82 are activated, and the NOR circuit86 outputs a signal having a low level. In this state, the high voltageof the power supply VCCH is applied to the fuse 85 via the activatedtransistor 81. This breaks the fuse 85.

After the fuse 85 is broken, the signal output by the NOR circuit 86 isnot high since the fuse 85 is broken even if the input terminal TE1receives the high signal again. Accordingly, the determination resultholding circuit 80 holds the low or high signal output from the BISTcircuit 64 and outputs the held signal from the output terminal TE2.

The first switching circuit unit 51 will now be discussed with referenceto FIG. 3.

A case in which a connection flaw is not detected during the conductiontest, that is, a case in which the wires 15 are connecting terminals ina normal manner will now be discussed.

In this case, the BIST circuit 64 outputs a signal having a high levelto the first to fourth determination result holding circuits 53 a-53 d.Each of the determination result holding circuits 53 a-53 d holds thehigh signal and outputs the held signal. This activates the firsttransistors 62 of the first to fourth switch circuits 54 a-54 d andconnects the input/output terminals I1-I4 respectively to the internalterminals 41-44.

In this state, the second switching circuit unit 52 switches theconnection of the terminals in response to the output signal from theBIST circuit (not shown) of the second chip 14. In this manner, when aconnection flaw is not detected, the redundant terminals 45, 50 of thefirst and second chips 13, 14 are not used.

A case in which there is a flaw in the connection between the internalterminals 43, 48, that is, a case in which the internal terminals 43, 48are deficient will now be discussed.

In this case, the BIST circuit 64 of the first chip 13 outputs a signalhaving a high level to the first and second determination result holdingcircuits 53 a, 53 b and a signal having a low level to the third andfourth determination result holding circuits 53 c, 53 d. This activatesthe first transistors 62 of the first and second switch circuit 54 a, 54b and connects the input/output terminals I1-I2 respectively to theinternal terminals 41-42. Further, the input/output terminal I3 isconnected to the internal terminal 44 and not the deficient internalterminal 43, and the input/output terminal I4 is connected to theredundant terminal 45.

In this state, the second switching circuit unit 52 switches theconnection of the terminals so that the input/output terminals I5-I8 arerespectively connected to the internal terminals 46, 47, 49 and theredundant terminal 50 in response to the output signal from the BISTcircuit (not shown) of the second chip 14.

The first embodiment has the advantages described below.

(1) The wires 15 connect the transistors 31-34 in series between theexternal terminals 22, 27 of the first and second chips 13, 14. Thetransistors 31-34 are activated and inactivated by means of the externalterminals 21, 26 of the first and second chips 13, 14. Accordingly, theconnection of the first and second chips 13, 14 are electrically testedwith the external terminals 21, 22, 26, 27 of the first and second chips13, 14. The conduction test enables detection of connection flawsbetween the first and second chips 13, 14 of the MCP 11. This improvesthe testing accuracy of the MCP 11.

(2) The conduction test is performed without actually activating thedevice. Thus, connection flaws caused by the wires 15 (wire openabnormality) are easily detected.

(3) When a connection flaw between the first and second chips 13, 14 isdetected in the conduction test, the deficient terminal is compensatedfor by the redundant terminals 45, 50. This increases the yield of theMCP 11.

A second embodiment according to the present invention will now bediscussed with reference to FIG. 6.

An MCP 11 of the second embodiment includes switching circuit units 101,102, which differ from those of the first embodiment. The first chip 13includes internal terminals 91 to 93 and a redundant terminal 94. Thesecond chip 14 includes internal terminals 95 to 97 and a redundantterminal 98.

The internal terminals 91-93 and redundant terminal 94 of the first chip13 are respectively connected to the internal terminals 95-97 andredundant terminal 98 of the second chip 14 by wires 15.

In the first chip 13, the internal terminals 91-93 and the redundantterminal 94 are connected to the input/output terminals I11 to I13 via afirst switching circuit unit 101. In the second chip 14, the internalterminals 95-97 and the redundant terminal 98 are connected to theinput/output terminals I14 to I16 via a second switching circuit unit102. The configurations of the first and second switching circuit units101, 102 are the same.

The first switching circuit unit 101 will now be discussed.

The first switching circuit unit 101 includes first to thirddetermination circuits 103 a to 103 c, first to third switch circuits104 a to 104 c, which are respectively associated with the determinationcircuits 103 a-103 c, and inverter circuits 105 a, 105 b, which areconnected to the redundant terminal 94. Each of the switch circuits 104a-104 c includes n-channel MOS transistors 111 to 115 and invertercircuits 116 to 118.

The test signal TB11 of a BIST circuit (not shown) is input to the gateof the transistors 111, 112 of the first switch circuit 104 a. The testsignal TB11 is also input to the gates of the transistors 113, 114 viathe inverter circuit 116. Accordingly, the transistors 111, 112 and thetransistors 113, 114 are activated and inactivated in a complementarymanner in accordance with the level of the test signal TB11 of the BISTcircuit.

When the transistors 113, 114 are activated, the input/output terminalI11 is connected to the internal terminal 91 via the activatedtransistors 113, 114 and the inverter circuits 117, 118. When thetransistors 111, 112 are activated, the first determination circuit 103a outputs a switching signal at a high level. The transistor 115 isactivated in response to the switching signal. This connects theinput/output terminal I11 to the redundant terminal 94 via thetransistor 115 and the inverter circuits 105 a, 105 b.

The second switch circuit 104 b connects the input/output terminal I12to either one of the internal terminal 92 and the redundant terminal 94in accordance with the output signals of the BIST circuit and the seconddetermination circuit 103 b. The third switch circuit 104 c connects theinput/output terminal I13 to either one of the internal terminal 93 andthe redundant terminal 94 in accordance with the test signal of the BISTcircuit and the switching signal of the second determination circuit 103c. That is, when there is a connection flaw in any one of the internalterminals 91-93, the first switching circuit unit 101 uses the redundantterminal 94 in lieu of the terminal having the connection flaw.

In this state, if there is a connection flaw in any one of the internalterminals 95-97 of the second chip 14, the second chip 14 also uses theredundant terminal 98 in lieu of the terminal having the connectionflaw.

Accordingly, in the second embodiment, when there is a flaw in theconnection between the first chip 13 and the second chip 14, remediationof the deficient terminal is enabled.

The first embodiment and the second embodiment may be modified asdescribed below.

The MCP 11 may include three or more of the chips 13, 14.

The MCP 11 may be a plane type MCP in which the first chip 13 and thesecond chip 14 are arranged side by side and connected to each other onthe substrate 12.

The transistors 31-34 of FIG. 2 may be replaced by p-channel MOStransistors.

The configuration of the first switching circuit unit 51 in the firstembodiment is not limited to that shown in FIG. 1. For example, when oneof the internal terminals 41-44 is determined as being deficient, theswitch circuits 54 a-54 d may switch the connection of the input/outputterminals I1-I4 to one of the two associated terminals (i.e., the twoassociated internal terminals or the associated internal terminal andredundant terminal) in accordance with the output signals of thedetermination result holding circuits 53 a-53 d.

The configuration of the first switching circuit unit 101 in the secondembodiment is not limited to that shown in FIG. 6. For example, when oneof the internal terminals 91-93 is determined as being deficient, theswitch circuits 104 a-104 d may switch the connection of theinput/output terminals I11-I13 from the deficient terminal to theredundant terminal 94 in accordance with the output signal of the BISTcircuit.

In the determination result holding circuit 80 of FIG. 5, the outputsignal of the BIST circuit is held when excessive voltage breaks thefuse 85. However, the output signal of the BIST circuit may be storedand held in, for example, a non-volatile memory.

It should be apparent to those skilled in the art that the presentinvention may be embodied in many other specific forms without departingfrom the spirit or scope of the invention. Therefore, the presentexamples and embodiments are to be considered as illustrative and notrestrictive, and the invention is not to be limited to the details givenherein, but may be modified within the scope and equivalence of theappended claims.

1. A semiconductor device comprising at least two semiconductor chips,each having a plurality of internal terminals, the at least twosemiconductor chips being connected to one another by each of theplurality of internal terminals, each of the semiconductor chipsincluding: at least one redundant terminal; a plurality of input/outputterminals associated with the plurality of internal terminals; a testcircuit for detecting whether there is an internal terminal causing aconnection flaw and for generating a plurality of test signals, eachcorresponding to one of the plurality of internal terminals; and aswitching circuit unit for switching a first set that includes theplurality of internal terminals including the internal terminal causinga connection flaw to a second set, that includes the plurality ofinternal terminals excluding the internal terminal causing a connectionflaw, and includes the at least one redundant terminal so as to connectthe second set to the plurality of input/output terminals.
 2. Thesemiconductor device according to claim 1, wherein the switching circuitunit includes: a plurality of switch circuits, each connected to anassociated one of the input/output terminals and to two terminalsselected from the plurality of internal terminals and the at least oneredundant terminal; a plurality of determination result holdingcircuits, each connected to an associated one of the switch circuits,wherein the plurality of determination result holding circuits each holdthe corresponding test signal and each provide the associated switchcircuit with an output signal having a level according to thecorresponding test signal, and wherein each of the switch circuitsselectively connects the associated input/output terminal to one of theassociated two terminals in accordance with the output signal.
 3. Thesemiconductor device according to claim 2, wherein each of the pluralityof determination result holding circuits includes a fuse and outputs anoutput signal having a predetermined level when the fuse of thedetermination result holding circuit that is associated with theinternal terminal causing a connection flaw is broken.
 4. Thesemiconductor device according to claim 1, wherein the switching circuitunit operates in accordance with test signals generated by the testcircuit.
 5. A semiconductor device comprising at least two semiconductorchips, each having a plurality of internal terminals, each of thesemiconductor chips including: at least one redundant terminal; aplurality of input/output terminals associated with the plurality ofinternal terminals; a test circuit for detecting whether there is aninternal terminal causing a connection flaw and for generating aplurality of test signals, each corresponding to one of the plurality ofinternal terminals; and a switching circuit unit for switching theinternal terminal causing a connection flaw to the at least oneredundant terminal so as to connect the input/output terminal associatedwith the internal terminal causing a connection flaw to the redundantterminal.
 6. The semiconductor device according to claim 5, wherein theswitching circuit unit includes: a plurality of switch circuits, eachconnected to an associated one of the input/output terminals and to twoterminals selected from the plurality of internal terminals and the atleast one redundant terminal; a plurality of determination circuits,each connected to an associated one of the input/output terminals togenerate a switching signal for switching the associated internalterminal to the redundant terminal in accordance with the correspondingtest signal, wherein each of the switch circuits selectively connectsthe associated input/output terminal to one of the two associatedterminals in accordance with the corresponding test signal and switchingsignal.
 7. The semiconductor device according to claim 5, wherein theswitching circuit unit operates in accordance with test signalsgenerated by the test circuit.
 8. A semiconductor device comprising: twosemiconductor chips, each having a plurality of internal terminals, afirst external terminal, and a second external terminal, the pluralityof internal terminals including a first internal terminal adjacent tothe first external terminal, and a second internal terminal adjacent tothe second external terminal with the internal terminals of the twosemiconductor chips connected to one another by a plurality of wires,each of the semiconductor chips including: at least one redundantterminal; a test circuit for detecting whether there is an internalterminal causing a connection flaw and for generating a plurality oftest signals, each corresponding to one of the plurality of internalterminals; and a switching circuit unit for switching a first set thatincludes the plurality of internal terminals including the internalterminal causing a connection flaw to a second set, that includes theplurality of internal terminals excluding the internal terminal causinga connection flaw, and includes the at least one redundant terminal; anintermediate switch device connected between the plurality of internalterminals so that the plurality of wires and the internal terminals areconnected in series; a first end switch device connected between thefirst internal terminal and the first external terminal; and a secondend switch device connected between the second internal terminal and thesecond external terminal.
 9. A semiconductor device comprising: at leasttwo semiconductor chips, each having a plurality of internal terminals,a first external terminal, and a second external terminal, the pluralityof internal terminals include a first internal terminal adjacent to thefirst external terminal and a second internal terminal adjacent to thesecond external terminal, each of the semiconductor chips including: atleast one redundant terminal; a test circuit for detecting whether thereis an internal terminal causing a connection flaw and for generating aplurality of test signals, each corresponding to one of the plurality ofinternal terminals; and a switching circuit unit for switching theinternal terminal causing a connection flaw to the at least oneredundant terminal; an intermediate switch device connected between theplurality of internal terminals so that the plurality of wires and theinternal terminals are connected in series; a first end switch deviceconnected between the first internal terminal and the first externalterminal; and a second end switch device connected between the secondinternal terminal and the second external terminal.
 10. A semiconductorpackage comprising a semiconductor device including at least twosemiconductor chips, each semiconductor chip comprising: a plurality ofinternal terminals, the two semiconductor chips being connected to oneanother by each of the plurality of internal terminals; at least oneredundant terminal; a plurality of input/output terminals associatedwith the plurality of internal terminals; a test circuit for detectingwhether there is an internal terminal causing a connection flaw and forgenerating a plurality of test signals, each corresponding to one of theplurality of internal terminals; and a switching circuit unit forswitching a first set that includes the plurality of internal terminalsincluding the internal terminal causing a connection flaw to a secondset, that includes the plurality of internal terminals excluding theinternal terminal causing a connection flaw, and includes the at leastone redundant terminal so as to connect the second set to the pluralityof input/output terminals.
 11. The semiconductor package according toclaim 10, wherein the switching circuit unit includes: a plurality ofswitch circuits, each connected to an associated one of the input/outputterminals and to two terminals selected from the plurality of internalterminals and the at least one redundant terminal; a plurality ofdetermination result holding circuits, each connected to an associatedone of the switch circuits, wherein the plurality of determinationresult holding circuits each hold the corresponding test signal and eachprovide the associated switch circuit with an output signal having alevel according to the corresponding test signal, and wherein each ofthe switch circuits selectively connects the associated input/outputterminal to one of the associated two terminals in accordance with theoutput signal.
 12. A semiconductor device comprising: a firstsemiconductor chip; a second semiconductor chip connected to the firstsemiconductor chip by a plurality of wires, wherein each of the firstand second semiconductor chips include; a plurality of input/outputterminals; a plurality of internal terminals associated with theplurality of the input/output terminals; at least one redundantterminal, wherein the at least one redundant terminal and the internalterminals are connected to the wires, and the number of redundantterminals of the first semiconductor chip is the same as the number ofredundant terminals of the second semiconductor chip; a test circuit fordetecting an internal terminal causing a connection flaw from theplurality of internal terminals; and a switching circuit unit forswitching the internal terminals including the internal terminal causinga connection flaw to the internal terminals excluding the internalterminal causing a connection flaw and to the at least one redundantterminal so as to connect the input/output terminals to the internalterminals excluding the internal terminal causing a connection flaw andto the at least one redundant terminal when detecting the internalterminal causing a connection flaw.
 13. The semiconductor deviceaccording to claim 12, wherein the first semiconductor chip issuperimposed on the second semiconductor chip.
 14. The semiconductordevice according to claim 12, wherein the first and second semiconductorchips each have a first external terminal and a second externalterminal, wherein the plurality of internal terminals of eachsemiconductor chip includes a first internal terminal adjacent to thefirst external terminal, and a second internal terminal adjacent to thesecond external terminal, wherein the test circuit of each semiconductorchip detects whether there is an internal terminal causing a connectionflaw and generates a plurality of test signals, each corresponding toone of the plurality of internal terminals, wherein the switchingcircuit unit of each semiconductor chip switches a first set, thatincludes the plurality of internal terminals including the internalterminal causing a connection flaw, to a second set, that includes theplurality of internal terminals excluding the internal terminal causinga connection flaw, and includes the at least one redundant terminal; andwherein the semiconductor device further comprising: an intermediateswitch device connected between the plurality of internal terminals sothat the plurality of wires and the internal terminals are connected inseries; a first end switch device connected between the first internalterminal and the first external terminal; and a second end switch deviceconnected between the second internal terminal and the second externalterminal.